Production deployment of depth-based metrology — range and height images, profile data, VisionPro 3D tooling, and traceable customer evidence.
Fine-pitch connector and assembly features need height, coplanarity, and profile data that 2D vision alone cannot reliably extract. Customers also require traceable evidence packages, not just a pass/fail bit.
Expanded UIC inspection capability from 2D-only workflows into a production-ready laser line-scan / Cognex hybrid architecture with reviewable metrology output and field-validated repeatability.
Lead vision engineer for acquisition, tooling, and deployment — I wrote the proprietary C# interface that streams LJ-X profiles into VisionPro (Ethernet configuration, external batch-start control, model-based Y/Z pitch management), built the 3D tool workflows, and ran onsite qualification, training, and handoff.
3D coplanarity, seating-plane analysis, and pin-level analytics from inspection CSV.
Read case study →What changes when vision systems leave the lab and enter customer factories.
Read note →Connector macro photography from the field and the bench.
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